Overcoming the Challenge of Heat Dissipation in LED Panel Lights

When it comes to LED panel lights, addressing the issue of heat dissipation involves three fundamental stages of heat transfer: from integrated chips to epitaxy, additional heat to the packaging baseplate, and baseplate to the heat sink or housing. Currently, the primary technical challenge in LED heat dissipation is temperature limitation on LED nodes. High temperatures can reduce the lifespan of LED integrated chips, phosphors, and encapsulation epoxy resin. To maintain the advantages of "high efficiency" and "long lifespan" of LED lighting, it is crucial to control the LED junction temperature.

Selection of Thermal Conductive Materials for LED Panel Lights

The choice of thermal conductive materials plays a vital role in addressing the technical challenges of heat dissipation. Selecting the right thermal conductive materials is a fundamental step that must be considered in the initial design phase of LED panel lights. Therefore, the selection of thermal conductive materials is the first step for LED lighting fixtures to achieve high efficiency and long lifespan.

LED lighting fixtures possess advantages such as zero pollution, low power consumption, and environmental friendliness, making them widely applicable across various industries. Currently, the shell of LED purification lamps is generally composed of a lamp cover and a base. The lamp cover covers the base, and the connecting components between the lamp cover and the base must be seamlessly joined to ensure that the light source is not harmed by environmental factors, enabling a more gentle and uniform projection of light into indoor spaces.

Heat Dissipation Design Solutions for LED Panel Lights

As LED panel light cannot employ heat dissipation fans or natural convection heat dissipation methods, the LED heat dissipation design solution must also consider the electronic and optical requirements of LED lighting fixtures.

Furthermore, the LED heat dissipation design solution must align with the requirements of the lighting fixture's aesthetic design. Only in this way can LED lighting fixtures have stronger selling points, and the aesthetic design of lighting fixtures constrains the LED heat dissipation design solution.

If the arrangement of heat dissipation sources is dispersed to reduce electronic and optical efficiency, it may lead to a loss in overall efficiency. This is because the cost of LED heat dissipation is relatively high, and the volume and weight constraints limit the addition of a substantial amount of high thermal conductive materials.

Thermal conductive materials include high thermal conductive silicone sheets, thermal conductive silicone grease, thermal phase-change materials, among others. Among them, high thermal conductive silicone sheets and pads offer a high cost-performance ratio, making them the preferred choice for raw materials in heat transfer and dissipation.